Chinese Optics Letters, Volume. 20, Issue 7, 071403(2022)

High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology Editors' Pick

Jing Liu1,2、*, Mingjin Wang1, Yufei Wang1,2,3,4, Xuyan Zhou1, Ting Fu1,2, Aiyi Qi1,3, Hongwei Qu1,2,3,4, Xiaoxu Xing1,2, and Wanhua Zheng1,2,3,4,5、**
Author Affiliations
  • 1Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • 2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
  • 3State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • 4College of Future Technology, University of Chinese Academy of Sciences, Beijing 101408, China
  • 5School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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    Jing Liu, Mingjin Wang, Yufei Wang, Xuyan Zhou, Ting Fu, Aiyi Qi, Hongwei Qu, Xiaoxu Xing, Wanhua Zheng. High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology[J]. Chinese Optics Letters, 2022, 20(7): 071403

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    Paper Information

    Category: Lasers, Optical Amplifiers, and Laser Optics

    Received: Jan. 28, 2022

    Accepted: Apr. 24, 2022

    Posted: Apr. 25, 2022

    Published Online: May. 26, 2022

    The Author Email: Jing Liu (jingliu@semi.ac.cn), Wanhua Zheng (whzheng@semi.ac.cn)

    DOI:10.3788/COL202220.071403

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