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Electro-Optic Technology Application, Volume. 27, Issue 6, 75(2012)

Simulation Analysis of Thermal Runaway of Sealed Chassis Based on ANSYS Icepak

LI Ling-na and LIN Jia
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    LI Ling-na, LIN Jia. Simulation Analysis of Thermal Runaway of Sealed Chassis Based on ANSYS Icepak[J]. Electro-Optic Technology Application, 2012, 27(6): 75

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    Paper Information

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    Received: Oct. 12, 2012

    Accepted: --

    Published Online: Jan. 14, 2013

    The Author Email:

    DOI:

    CSTR:32186.14.

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology