Infrared and Laser Engineering, Volume. 51, Issue 6, 20210430(2022)
Terahertz time domain characterization method of the adhesive layer uniformity in multiple bonding structures
Fig. 1. Schematic diagram of terahertz time-domain spectroscopy system
Fig. 2. Schematic diagram of multiple bonding structure and terahertz time-domain waveform
Fig. 3. Schematic diagram of flight time at different positions of upper adhesive layer
Fig. 4. Flight time of difference imaging of different experimental samples
Fig. 5. Energy integral diagram of different thickness of upper rubber layer
Fig. 6. Energy integration imaging of different experimental samples
Fig. 7. Energy integration curves of different experimental samples
Fig. 8. Schematic diagram of amplitude variation of different thickness of upper adhesive layer
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Jiatian Wang, Chuang Liu, Jiaojiao Ren, Dandan Zhang, Jian Gu. Terahertz time domain characterization method of the adhesive layer uniformity in multiple bonding structures[J]. Infrared and Laser Engineering, 2022, 51(6): 20210430
Category: Terahertz technology and application
Received: Jun. 28, 2021
Accepted: --
Published Online: Dec. 20, 2022
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