International Journal of Extreme Manufacturing, Volume. 1, Issue 4, 45002(2019)

Femtosecond laser additive and subtractive micro-processing: enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging

Gligor Djogo1,*... Jianzhao Li1, Stephen Ho1, Moez Haque1, Erden Ertorer1, Jun Liu2, Xiaolu Song2, Jing Suo2 and Peter R Herman1 |Show fewer author(s)
Author Affiliations
  • 1The Edward S Rogers Sr Department of Electrical & Computer Engineering, University of Toronto,Toronto, Canada
  • 2Transmission & Access Research Department, Huawei Technologies Co., Ltd, Dongguan, People’s Republic of China
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    Gligor Djogo, Jianzhao Li, Stephen Ho, Moez Haque, Erden Ertorer, Jun Liu, Xiaolu Song, Jing Suo, Peter R Herman. Femtosecond laser additive and subtractive micro-processing: enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging[J]. International Journal of Extreme Manufacturing, 2019, 1(4): 45002

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    Paper Information

    Received: Aug. 28, 2019

    Accepted: --

    Published Online: Jun. 4, 2020

    The Author Email: Djogo Gligor (g.djogo@mail.utoronto.ca)

    DOI:10.1088/2631-7990/ab4d51

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