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Acta Photonica Sinica, Volume. 47, Issue 6, 614001(2018)

Effect of Packaging on Thermal Stressand Smile of High Power Semiconductor Laser Arrays

CHEN Tian-qi1,2、*, ZHANG Pu1, PENG Bo1,2, ZHANG Hong-you1,2, and WU Di-hai1,2
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    CHEN Tian-qi, ZHANG Pu, PENG Bo, ZHANG Hong-you, WU Di-hai. Effect of Packaging on Thermal Stressand Smile of High Power Semiconductor Laser Arrays[J]. Acta Photonica Sinica, 2018, 47(6): 614001

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    Paper Information

    Received: Jan. 15, 2018

    Accepted: --

    Published Online: Sep. 7, 2018

    The Author Email: Tian-qi CHEN (chentianqi2015@opt.cn)

    DOI:10.3788/gzxb20184706.0614001

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology