[1] [1] LING Y,ZHANG K L,WANG F,et al..Investigation on the final polishing slurry and technique of silicon substrate in ULSI[J].Microelectronic Engineering,2003(66):438-444.

[3] [3] JEONG-DU K.Motion analysis of powder particles in EEM using cylindrical polyurethane wheel[J].International Journal of Machine Tools&Manufacture,2002,42:21-28.

[5] [5] B S HAN I Z.Deformation and material removal rate in polishing silicon wafcrs[J].Journal of Materials Processing Technology,2003,140(9):641-645.

[7] [7] SANZ-NAVARRO C F,KENNY S D,SMITH R.Atomistic simulations of structural transformations of siliconsurfaces under nanoindentation[J].Nanotechnology,2004(15):692-697.

[9] [9] ZHAO J,CAO Z Q,ZHAN J M,et al..Research on hydrodynamic suspension nano-scale polishing for K9 optical glass[C].Proceedings of International Confefence On Surface Finishing Technology and Surface Engineering,Dalian,P.R.China:ICSFT,2006:273-279.

[12] [12] COOK L M.Chemical processes in glass polishing[J].Journal of Non-Crystalline Solids,1990,120:152-171.

[13] [13] CHARLES R J.Static fatigue of glass.I[J].Journal of Applied Physics,1958,29(11):1549-1553.

[14] [14] CLARK D E.Corrosion of glass surfaces[J].Surface Science,1980,100:53-70.