Fig. 1. Schematic of laser grooving process

Fig. 2. Common incision processing technologies. (a) Mechanical broaching; (b) wire cutting processing; (c) laser cutting

Fig. 3. Rotary cutter fabricated by Japan Honda^[19]

Fig. 4. Wire cutting equipment. (a) Single-arm wire-free wire electrical discharge machining (WEDM) equipment; (b) two-way synchronous cutting WEDM equipment; (c) double-arm wire-free WEDM equipment

Fig. 5. MAUSER grooving method

Fig. 6. Method of grooving by Japan Honda^[11]

Fig. 7. Laser cutting method of Swiss LASAG company

Fig. 8. Laser grooving device of Jilin University^[23]

Fig. 9. LFS150 expanding and breaking connecting rod laser grooving equipment^[25-26]

Fig. 10. Physical picture of connecting rod cracking tank^[33]

Fig. 11. Scanning electron micrograph of connecting rod cracking tank. (a) Cracking tank width picture;(b) cracking tank depth picture

Fig. 12. The second generation equipment of laser grooving for expanding and breaking connecting rod. (a) The physical photograph of the second-generation laser grooving equipment; (b) diagram of the second generation of laser grooving equipment

Fig. 13. The third generation of laser grooving equipment for expanding and breaking connecting rods. (a) Physical picture of the third generation laser grooving equipment; (b) three-dimensional model of the third generation laser grooving equipment