Journal of Radiation Research and Radiation Processing, Volume. 41, Issue 3, 030101(2023)

Progress of research on double-strand break damage induced by heavy-ion beam radiation and repair mechanism

Junle REN1,2, Xiaopeng GUO3, Cairong LEI1,2, Miaomiao ZHANG1,2,4, Ran CHAI3, and Dong LU1,2,4、*
Author Affiliations
  • 1Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000, China
  • 2University of Chinese Academy of Sciences, Beijing 100049, China
  • 3Lanzhou University of Technology, Lanzhou 730050, China
  • 4Key Laboratory of Microbial Resources Development and Utilization of Gansu Province, Lanzhou 730070, China
  • show less

    Heavy-ion beam radiation can cause cell DNA double-strand breaks (DSBs), which are factors that lead to genomic instability. Existing studies have demonstrated that homologous end joining, homologous recombination, single-strand annealing, and selective end joining play critical roles in the repair of DNA DSBs. However, the factors that affect the selection of repair pathways for DNA DSBs remain unclear. In this study, recent findings on DNA damage characteristics and repair pathways generated by heavy-ion radiation cells are reviewed, and the selection mechanism of DSB repair pathways in cells is explained in terms of the types and distribution of DNA DSBs, chromatin status, DNA terminal structures, DNA terminal excision, and cell cycles. This review is of great significance for the study of DNA damage repair and provides a reference for investigating the biological effects of heavy-ion radiation technology.

    Tools

    Get Citation

    Copy Citation Text

    Junle REN, Xiaopeng GUO, Cairong LEI, Miaomiao ZHANG, Ran CHAI, Dong LU. Progress of research on double-strand break damage induced by heavy-ion beam radiation and repair mechanism[J]. Journal of Radiation Research and Radiation Processing, 2023, 41(3): 030101

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Research Articles

    Received: Aug. 9, 2022

    Accepted: Feb. 28, 2023

    Published Online: Jul. 24, 2023

    The Author Email:

    DOI:10.11889/j.1000-3436.2022-0081

    Topics