[1] [1] RAO X SH, ZHANG F H, LIU L F, et al.. Surface characteristics for RB-SiC ceramics by electrical discharge diamond grinding［J］. Opt. Precision Eng., 2016, 24(9): 2192-2199. (in Chinese)

[2] [2] WANG ZH. Study on the detection and control techniques of subsurface damage in optical fabrication［D］. Changsha: National University of Defense Technology, 2008. (in Chinese)

[3] [3] LIU J, MA ZH L, WANG J L. Research status of subsurface damage detection technology of optical elements［J］. Laser & Optoelectronics Progress, 2011, 48(8): 081204. (in Chinese)

[4] [4] WANG J, ZHENG F F, DONG ZH G, et al.. Detection method of subsurface damage of silicon carbide after grinding［J］. Diamond & Abrasives Engineering, 2015, 35(4): 60-65. (in Chinese)

[5] [5] ZHANG B, ZHENG X L, TOKURA H, et al.. Grinding induced damage in ceramics［J］. Journal of Materials Processing Technology, 2003, 132(1-3): 353-364.

[6] [6] LIU M H. Research on precision grinding subsurface damage and prediction of silicon carbide ceramic［D］. Harbin: Harbin Institute of Technology, 2014. (in Chinese)

[7] [7] LIANG X H. Research on grinding removal mechanism and subsurface crack of silicon carbide［D］. Harbin: Harbin Institute of Technology, 2013. (in Chinese)

[8] [8] ZENG Y F. Study on the surface layer quality of RB-SiC after grinding［D］. Dalian: Dalian University of Technology, 2014. (in Chinese)

[9] [9] YAO W. Investigation on material removal mechanisms and grinding parameters optimization of reaction bonded silicon carbide［D］. Harbin: Harbin Institute of Technology, 2008. (in Chinese)

[10] [10] AGARWAL S, RAO P V. Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding［J］. International Journal of Machine Tools and Manufacture, 2008, 48(6): 698-710.

[11] [11] YANG X H, HAN J C. Experimental study on ultrasonic vibration grinding of brittle optical materials［J］. Optical Technique, 2007, 33(1): 65-67. (in Chinese)

[12] [12] ZHANG C L, FENG P F, ZHANG J F, et al.. Theoretical and experimental research on the features of cutting force in rotary ultrasonic face milling of K9 glass［J］. Applied Mechanics and Materials, 2012, 157-158: 1674-1679.

[13] [13] CHURI N J, PEI Z J, SHORTER D C. Rotary ultrasonic machining of dental ceramics［J］. International Journal of Machining and Machinability of Materials, 2009, 6(3-4): 270-284.

[14] [14] ZHANG C L, FENG P F, PEI Z J, et al.. Rotary ultrasonic machining of sapphire: feasibility study and designed experiments［J］. Key Engineering Materials, 2014, 589-590: 523-528.

[15] [15] CONG W L, PEI Z J, DEINES T W, et al.. Rotary ultrasonic machining of CFRP composites: a study on power consumption［J］. Ultrasonics, 2012, 52(8): 1030-1037.

[16] [16] QIAO G C. Research on machined surface integrity in ultrasonic vibration mill-grinding of silicon nitride ceramics［D］. Harbin: Harbin Institute of Technology, 2013. (in Chinese)

[17] [17] WANG J. Study on the ultrasonic assisted grinding process of RBSiC［D］. Dalian: Dalian University of Technology, 2015. (in Chinese)

[18] [18] HELBAWI H, ZHANG L C, ZARUDI I, et al.. Difference in subsurface damage in indented specimens with and without bonding layer［J］. International Journal of Mechanical Sciences, 2001, 43(4): 1107-1121.

[19] [19] WEI S L. Research on the process of rotary ultrasonic grinding machining for Si3N4 ceramics［D］. Harbin: Harbin Engineering University, 2012. (in Chinese)