Optics and Precision Engineering, Volume. 21, Issue 6, 1447(2013)

Micromachining of LTCC substrate for 60 GHz patch antenna

MIAO Min1...2,*, ZHANG Xiao-qing1, YAO Ya-ting1, MU Fang-qing3 and HU Du-wei2 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    References(14)

    [1] [1] DANIELS R C, HEATH R W. 60 GHz wireless communications: emerging requirements and design recommendations [J]. IEEE Vehicular Technology Magazine, 2007,2(3):41-50.

    [2] [2] HUNT B, DEVLIN L. LTCC for RF modules [C]. Packaging and interconnects at microwave and mm-wave frequencies, IEEE Seminar, 2000: 511-515.

    [3] [3] LI R L, DEJEAN G, MAENG M, et al.. Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications [J]. IEEE Transactions on Advanced Packaging, 2004, 27(4): 581-589.

    [4] [4] BYUN W, EUN K CH, KIM K S, et al.. Design of 8×8 stacked patch array antenna on LTCC substrate operating at 40GHz band [C]. Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings, 2005: 1-4.

    [5] [5] BONDARIK A, JUN D S, KIM J M, et al.. Investigation of microstrip antenna array stacked structure realized on LTCC for 60 GHz band [J]. Microwave and Optical Technology Letters, 2010, 52(3):648-652.

    [6] [6] LIAO X P, XIAO J B. Transient S-parameters of millimeter-wave MEMS switch [J]. Opt. Precision Eng., 2012, 19(3):593-597. (in Chinese)

    [7] [7] KHOONG L E, TAN Y M, LAMA Y C. Overview on fabrication of three-dimensional structures in multi-layer ceramic substrate [J]. Journal of the European Ceramic Society,2010,30:1973–1987.

    [8] [8] MIAO M, JIN Y F, GAN H, et al.. Investigation of a Unified LTCC-based Micromachining and Packaging Platform for High Density/Multifunctional Microsystem Integration[C]. The 62nd Electronic Components and Technology Conference (ECTC), San Diego, California, USA, 2012 :377-384.

    [11] [11] GODARA L C. Handbook of Antennas in Wireless Communication [M]. Boca Raton, London, New York Washington:CRC Press, 2002:34-49.

    [12] [12] THELEMANN T, THUST H, BISCHOFF G, et al.. Liquid cooled LTCC-substrates for high power applications [J]. The International Journal of Microcircuits and Electronic Packaging, 2000, 23(2):209-214.

    [13] [13] ZHANG Y F, CHEN J Q, BAI SH L, et al.. Microchannel water cooling for LTCC based microsystems [C]. 11th Electronics Packaging Technology Conference (EPTC), 2009: 626-629.

    [14] [14] KUMAR G, RAY K P. Broadband Microstrip Antennas [M].USA:Artech House, 2003:7-9.

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    MIAO Min, ZHANG Xiao-qing, YAO Ya-ting, MU Fang-qing, HU Du-wei. Micromachining of LTCC substrate for 60 GHz patch antenna[J]. Optics and Precision Engineering, 2013, 21(6): 1447

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    Paper Information

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    Received: Jan. 18, 2013

    Accepted: --

    Published Online: Jul. 1, 2013

    The Author Email: Min MIAO (miaomin@bistu.edu.cn)

    DOI:10.3788/ope.20132106.1447

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