Laser & Optoelectronics Progress, Volume. 56, Issue 9, 091402(2019)
Packaging of Semiconductor Laser Bars in Tube Furnace
The 808 nm high-power semiconductor laser bars are used for packaging to optimize the two important factors that affect the package quality: the furnace tube temperature and the soldering time. The results show that the solder layer has the least voids when the soldering time is 100 s at a tube furnace temperature of 650 ℃. Moreover, the obtained semiconductor laser bar has the lowest smile effect value, the smallest threshold current, a more stable wavelength, and the best soldering quality.
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Qiuyue Zhang, Hongqi Jing, Qinghe Yuan, Xiaoyu Ma, Lianhe Dong. Packaging of Semiconductor Laser Bars in Tube Furnace[J]. Laser & Optoelectronics Progress, 2019, 56(9): 091402
Category: Lasers and Laser Optics
Received: Sep. 5, 2018
Accepted: Nov. 27, 2018
Published Online: Jul. 5, 2019
The Author Email: Dong Lianhe (custdong@126.com)