INFRARED, Volume. 43, Issue 1, 6(2022)
Study of Indium Bump Fabrication for Infrared Detector with 10 μm Pitch
References(3)
[7] [7] She W L, Zhou L Q, Bruker Q B, et al. Manufacturing Application Study of CdZnTe Wafers Using Automated X-ray Metrology［C］. New York: Advanced Semiconductor Manufacturing Conference, 2018.
[8] [8] Dahlin M J,O′Rourke E J. Advanced Focal Plane Array Systems for Next-Generation Scanning Remote Sensing Instrument［C］. SPIE, 2003, 4820： 406-417.
[9] [9] Manissadjian A, Rubaldo L, Mollard L, et al. Improved IR Detectors to Swap Heavy Systems for SWaP［C］. SPIE, 2012, 8353: 835334.
Tools
Get Citation
Copy Citation Text
[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Study of Indium Bump Fabrication for Infrared Detector with 10 μm Pitch[J]. INFRARED, 2022, 43(1): 6
Paper Information
Received: Aug. 18, 2021
Accepted: --
Published Online: Mar. 10, 2022
The Author Email: (matao@cetc.com.cn)
© Copyright 2018-2021 | Chinese Laser Press.
All Rights Reserved 沪ICP备15018463号-20