Fig. 1. Schematic diagram of experimental apparatus and the rear and front side ablation of Cu film

Fig. 2. The widths of micro-grooves ablated by ns laser Gaussian beam at the scan speed from 0.5 to 2.5 mm/s and pulse energy from 0.072 to 0.542 µJ

Fig. 3. Comparison diagram of front and rear ablation under the same conditions at the scan speed 2 mm/s and different pulse energy

Fig. 4. SEM image of the front and rear side ablation

Fig. 5. Simulated temperature field of ablation Cu film on the front and rear side at a pulse energy of 0.083 μJ

Fig. 6. The surface morphology of Cu film by the single pulse on the front and rear side ablation at the pulse energy of 0.072 μJ and 0.155 μJ

Fig. 7. Simulated temperature field of ablation Cu film on the front and rear side at 3.9 ns

Fig. 8. Cu array are prepared by laser induced rear side ablation

Fig. 9. Complex microcircuits are prepared by laser induced rear side selective ablation