Recognition of PCB solder joints and core wire ends

Hanlin LIU; Rongfu ZHANG

doi:10.3969/j.issn.1005-5630.2022.005.006

Optical Instruments, Volume. 44, Issue 5, 42(2022)

Recognition of PCB solder joints and core wire ends

Hanlin LIU and Rongfu ZHANG^*

School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China

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References(3)

[2] HSU C W, LIN C J. A comparison of methods for multi-class support vector machines[J]. IEEE Transactions on Neural Networks, 13, 415-425(2002).

[6] [6] GONZALEZ R C, WOODS R E. Digital image processing[M]. 3rd ed. London: Pearson, 2007: 88 96.

[10] [10] ZHANG Y J. Image engineering: image analysis[M]. 2nd ed. Beijing: Tsinghua University Press, 2005.

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Hanlin LIU, Rongfu ZHANG. Recognition of PCB solder joints and core wire ends[J]. Optical Instruments, 2022, 44(5): 42

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Paper Information

Category: APPLICATION TECHNOLOGY

Received: Feb. 28, 2022

Accepted: --

Published Online: Nov. 14, 2022

The Author Email: ZHANG Rongfu (zrf@usst.edu.cn)

DOI:10.3969/j.issn.1005-5630.2022.005.006

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology

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