Optics and Precision Engineering, Volume. 31, Issue 16, 2362(2023)
Modeling and experimental study on material removal rate of quartz wafer by fixed abrasive lapping
Figures & Tables(14)
Fig. 4. Micro-contact morphology between fixed abrasive lapping pad and wafer
Fig. 11. Material removal rate under different relative velocities
Table 1. Correspondence table of factor and level
View tableView in ArticleTable 1. Correspondence table of factor and level
Level Concentration Flow rate Disc speed f （wt.%） c（ml/min） np（r/min） 1 0 12 10 2 3 24 20 3 6 36 30 4 9 48 40
Table 2. Parameters used in the test
View tableView in ArticleTable 2. Parameters used in the test
Parameter Value Parameter Value ρc 3.52 g/cm3 g 5.3 mm 9 μm ω 0.5 g/cm3 σ 9/12 ρ 2.2 g/cm3 β 45° KIC 0.73 MPa·m1/2 r 1.9 mm Hv 6.67 GPa l 1.5 mm E 72.5 GPa P 48 kPa S 25 mm2
Table 3.
MMR andK -value test resultsView tableView in ArticleTable 3.
MMR andK -value test resultsNo. f c np MMR（μm/min） K 1 1 1 1 13.01 0.128 2 1 2 2 28.62 0.141 3 1 3 3 47.11 0.154 4 1 4 4 65.68 0.161 5 2 1 2 48.31 0.237 6 2 2 1 25.39 0.250 7 2 3 4 86.51 0.213 8 2 4 3 69.41 0.227 9 3 1 3 59.50 0.195 10 3 2 4 85.99 0.211 11 3 3 1 23.49 0.231 12 3 4 2 42.79 0.210 13 4 1 4 57.96 0.142 14 4 2 3 55.73 0.183 15 4 3 2 35.02 0.172 16 4 4 1 13.47 0.132
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Yufan JIA, Xianglong ZHU, Lei YANG, Renke KANG, Zhigang DONG. Modeling and experimental study on material removal rate of quartz wafer by fixed abrasive lapping[J]. Optics and Precision Engineering, 2023, 31(16): 2362
Paper Information
Category: Micro/Nano Technology and Fine Mechanics
Received: Mar. 8, 2023
Accepted: --
Published Online: Sep. 5, 2023
The Author Email: KANG Renke (kangrk@dlut.edu.cn)
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