Infrared and Laser Engineering, Volume. 53, Issue 7, 20240139(2024)

Characterization of magnetic composite fluid polishing removal of fused silica elements

Hui YE1... Zhuang LI1, Jian WANG1, Chen JIANG1 and Laixi SUN2,* |Show fewer author(s)
Author Affiliations
  • 1School of Mechanical Enginnering, University of Shanghai for Science and Technology, Shanghai 200093, China
  • 2Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China
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    Figures & Tables(16)
    Schematic diagram of MCF polishing device and principle
    Schematic diagram of the formation of magnetic clusters in the polishing head
    Schematic diagram of the polished cross-section profile over time
    Three-dimensional and two-dimensional contours of polished spots (A3, MCF polished for 15 min)
    Volume removal and removal rate of polished material
    Surface microstructure of workpiece
    Evolution of surface roughness with polishing time
    Model of contact between polishing wheel and workpiece and microscopic morphology of magnetic clusters
    Spatial distribution law of MCF polishing fluid dynamic pressure \begin{document}$ {P}_{d} $\end{document}
    Modeling of MCF and UMCF polished grit forces and fused silica element indentation
    Polishing area pressure at different times for MCF and UMCF polishing
    Schematic diagram of the "double-edged circle" model
    Mathematical model of material removal rate
    • Table 1. Parameters of polishing experiments

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      Table 1. Parameters of polishing experiments

      Polishing parameterValue
      Workpiece materialsFused silica
      Workpiece size(length/width/height)/mm40/40/10
      polishing gap h0/mm1.0
      Polishing time t/min5, 10, 15
      Polishing wheel speed $ {n}_{t} $/r·min−1300
      Magnetic flux density B/T0.4
      Ultrasonic amplitude A/μm0,25
      Ultrasonic vibration frequency f/Hz19000
      Polishing wheel size(OD/ID/thickness)/mm40/25/8
      Baffle size (OD/ID/thickness)/mm40/25/4
    • Table 2. Experimental results

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      Table 2. Experimental results

      Serial No.Polishing methodPolishing timet/minMaximum depth MRdmax/μmX direction dimension/mmY direction dimension/mmSurface roughnessRa/μmMaterial volume removalMR/mm3
      U0MCF0---0.765-
      A154.824.192.580.4240.71×10−2
      A2108.174.353.200.3851.95×10−2
      A31511.705.023.450.3473.29×10−2
      B1UMCF(A=25 μm)55.684.792.780.3662.87×10−2
      B21010.135.353.400.1333.85×10−2
      B31512.125.613.650.1084.28×10−2
    • Table 3. Material removal rate model fitting parameters

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      Table 3. Material removal rate model fitting parameters

      ParametersKαβR2
      MCF0.04170.36080.295.80%
      UMCF7.978×10−42.31−1.2499.98%
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    Hui YE, Zhuang LI, Jian WANG, Chen JIANG, Laixi SUN. Characterization of magnetic composite fluid polishing removal of fused silica elements[J]. Infrared and Laser Engineering, 2024, 53(7): 20240139

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    Paper Information

    Category: Optical fabrication

    Received: Mar. 4, 2024

    Accepted: --

    Published Online: Aug. 9, 2024

    The Author Email: SUN Laixi (sunlaixi@126.com)

    DOI:10.3788/IRLA20240139

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