Fig. 1. (a) Schematic diagram of laser separate; (b) Nonlinear absorption and microstructure evolution during laser separate; (c) Laser spatiotemporal regulation

Fig. 2. Evolution of transparent hard brittle materials^[4]: (a) changes in refractive index^[51]; (b) nano gratings^[52]; (c) nano-voids^[53]; (d) crack propagation^[10]

Fig. 3. Process of temperature change inside a silicon wafer under the action of a single pulse laser ^[55]

Fig. 4. Schematic diagram of axial propagation of spatiotemporal focused beams^[58]

Fig. 5. Schematic diagram of adaptive optical system^[59]

Fig. 6. Multi beam parallel femtosecond laser direct writing optical path map^[66]

Fig. 7. Schematic diagram of cold cracking process^[71]

Fig. 8. Physical image of wafer automatic separation equipment^[72]

Fig. 9. Schematic diagram of a picosecond laser system for silicon carbide processing^[10]

Fig. 10. Combining method of femtosecond laser irradiation and bandgap-selective photo-electrochemical (PEC) exfoliation ^[75]

Fig. 11. Schematic diagram of surface roughness for laser assisted splitting of different materials^[71]

Fig. 12. Schematic diagram of the internal modification process of gallium nitride by focusing femtosecond laser through a high numerical aperture objective lens^[80]

Fig. 13. Laser induced diamond graphitization splitting process^[83]