Infrared and Laser Engineering, Volume. 51, Issue 6, 20210640(2022)

Design of on-chip dot array structured light projector using bottom-emitting VCSEL

Renjie Ruan1,2,3, Yinhua Cao1,2,3, Xiaofan Wang1,2,3, Yanhong Ma1,2,3, Zhiyong Wang1,2,3, and Tian Lan1,2,3、*
Author Affiliations
  • 1Beijing Engineering Research Center of Laser Technology, Beijing University of Technology, Beijing 100124, China
  • 2Key Laboratory of Trans-scale Laser Manufacturing Technology, Ministry of Education, Beijing University of Technology, Beijing 100124, China
  • 3Institute of Advanced Technology on Semiconductor Optics & Electronics, Department of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China
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    Figures & Tables(10)
    Schematic diagram of existing dot array structured light projector
    Schematic diagram of on-chip dot array structured light projector
    Dot array coded pattern
    Simulation results under different sampling ratio
    Output light intensity distribution of structure-1
    Comparison diagram of evaluation index under different sampling ratio
    Evaluation index under different oxide apertures
    Evaluation index under different thickness of substrate
    Simulation results under the optimized design parameters
    • Table 1. Structural parameters used in structure-2

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      Table 1. Structural parameters used in structure-2

      ParameterValue
      Wavelength,λ/nm 980
      Length of target light field,Lx/m 0.01
      Width of target light field,Ly/m 0.01
      Waist radius of VCSEL,w0/μm 2
      Distance from oxide aperture to DOE,z/μm 505
      Thickness of substrate,L/μm 500
      Refractive index of GaAs,n3.52
      Horizontal sampling ratio,M-
      Longitudinal sampling ratio,N-
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    Renjie Ruan, Yinhua Cao, Xiaofan Wang, Yanhong Ma, Zhiyong Wang, Tian Lan. Design of on-chip dot array structured light projector using bottom-emitting VCSEL[J]. Infrared and Laser Engineering, 2022, 51(6): 20210640

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    Paper Information

    Category: Optical design

    Received: Sep. 3, 2021

    Accepted: --

    Published Online: Dec. 20, 2022

    The Author Email:

    DOI:10.3788/IRLA20210640

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