Acta Photonica Sinica, Volume. 49, Issue 3, 0306001(2020)

Effect Analysis of Embedded Fiber Transmission Performance by Lamination Process

Yu-lai SHE1... De-jian ZHOU1, Xiao-yong CHEN1, Xu YANG2, Shan TU3 and Hua-jun LAI4 |Show fewer author(s)
Author Affiliations
  • 1School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi 541004, China
  • 2School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
  • 3Institute of Physical Science and Technology, Guangxi Normal University, Guilin, Guangxi 541004, China
  • 4Guangxi Key Laboratory of Information Material, Guilin, Guangxi 541004, China
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    References(10)

    [3] [3] UEMURA H, HAMASAKI H, FURUYAMA H, et al. Hybrid optical interconnection module with builtin electrical power line f mobile phone using highlyflexible integrallyfmed OEFPC[C]. 200959th Electronic Components Technology Conference, IEEE, 2009: 21012105.

    [4] [4] KELLER C, SHAO Z, WAKAZONO Y, et al. Planar assembled flexible interconnect link with hybrid opticalelectrical data transmission f mobile device applications[C]. IEEE, Electronic Components Technology Conference, 2011: 823828.

    [13] [13] STEFAN W, DESMULIEZ M P Y. Surface embossing of LTCC during the lamination process[C]. 2012 Symposium on Design, Test, Integration Packaging of MEMSMOEMS, IEEE, 2012: 181184.

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    Yu-lai SHE, De-jian ZHOU, Xiao-yong CHEN, Xu YANG, Shan TU, Hua-jun LAI. Effect Analysis of Embedded Fiber Transmission Performance by Lamination Process[J]. Acta Photonica Sinica, 2020, 49(3): 0306001

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    Paper Information

    Category: Fiber Optics and Optical Communications

    Received: Oct. 16, 2019

    Accepted: Jan. 3, 2020

    Published Online: Apr. 24, 2020

    The Author Email:

    DOI:10.3788/gzxb20204903.0306001

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