Journal of Inorganic Materials, Volume. 34, Issue 7, 748(2019)

Correlation between Stacking Faults in Epitaxial Layers of 4H-SiC and Defects in 4H-SiC Substrate

Yu GUO1...2, Tong-Hua PENG1,2,*, Chun-Jun LIU1, Zhan-Wei YANG1 and Zhen-Li CAI1 |Show fewer author(s)
Author Affiliations
  • 1Beijing Tankeblue Semiconductor Co. Ltd, Beijing 102600, China
  • 2Xinjiang Tianfu Energy Co. Ltd., Shihezi 832000, China
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    References(30)

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    [3] H CHANG S, C LIU X, W HUANG et al. Preparation and properties of lateral contact structure SiC photoconductive semiconductor switches. Journal of Inorganic Materials, 27, 1058-1062(2012).

    [10] X ZHANG, Y HA S, S BENAMARA et al. Structure of carrot defects in 4H-SiC epilayers. Materials Science Forum, 527-529, 327-332(2006).

    [14] H RADU, S STEFAN G, T DENIS E et al. Identification of stacking faults in silicon carbide by polarization-resolved second harmonic generation microscopy. Scientific Reports, 7(2017).

    [15] Y HIDEKAZU. Assessment of stacking faults in silicon carbide crystals. Sensors and Materials, 25, 177-187(2013).

    [21] S OKOJIE R, X HUANG, M DUDLEY et al. Process-induced deformations and stacking faults in 4H-SiC. MRS Proceedings, 911, B07-02(2011).

    [23] M YUTARO, Y SHUHEI, H YASUTO et al. Photoluminescence study of oxidation-induced stacking faults in 4H-SiC epilayers. Materials Science Forum Vols, 5, 327-330(2015).

    [24] Y LI Z, T LIU L, X DONG et al. Defects in homogeneous epitaxial layers of 4H-SiC. Equipment for Electronic Products Manufacturing, 11, 62-64(2005).

    [28] A GALECKAS, J LINNROS, P PIROUZ et al. Recombination- induced stacking faults: evidence for a general mechanism in hexagonal SiC. Phys. Rev. Lett, 96(2006).

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    Yu GUO, Tong-Hua PENG, Chun-Jun LIU, Zhan-Wei YANG, Zhen-Li CAI. Correlation between Stacking Faults in Epitaxial Layers of 4H-SiC and Defects in 4H-SiC Substrate[J]. Journal of Inorganic Materials, 2019, 34(7): 748

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    Paper Information

    Category: RESEARCH PAPER

    Received: Sep. 20, 2018

    Accepted: --

    Published Online: Sep. 26, 2021

    The Author Email: Tong-Hua PENG (pengtonghua1115@sina.com)

    DOI:10.15541/jim20180443

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