Fig. 1. Framework of ball grid array package

Fig. 2. Quasi back-to-back model of non-vertical interconnection structure

Fig. 3. Simulation results of non-vertical structures with different misalignment angles

Fig. 4. Simulation results of non-vertical structures with different number of steps

Fig. 5. Simulation results of non-vertical structures with different solder ball radii and pitches

Fig. 6. Optimized result of non-vertical interconnection structure

Fig. 7. Quasi back-to-back physical map of non-vertical interconnection structure

Fig. 8. Test results of non-vertical interconnection structure

Fig. 9. Block diagram of signal transmission simulation structure

Fig. 10. Transmission eye diagrams

Fig. 11. Eye diagrams for the 112 Gb/s PAM4