The advent of 5G technology has spurred rapid advancements in high-speed signal development， leading to increasing bandwidth requirements for signal channels. This study examines the microwave characteristics of "quasi-coaxial" interconnections in ceramic substrates and proposes a novel non-vertical interconnection structure. By optimizing the design of metallized vias between ceramic layers， the impedance at the junction of vertical vias and horizontal transmission lines is improved， enhancing high-frequency signal transmission and broadening bandwidth. The paper analyzes the effect of misalignment angle， ladder series， solder ball radius， and distance between solder balls on transmission performance. The result is a broadband， low-loss ceramic substrate interconnection. Experimental results show that the structure can operate at 55 GHz with an insertion loss less than 1.5 dB and a return loss greater than 15 dB in the DC-55 GHz band. The measured data demonstrate satisfactory transmission of 56 G/112 G NRZ and 112 G PAM4 high-speed signals without the need for preweighting and equalization.