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Photonic Sensors, Volume. 12, Issue 2, 130(2022)

All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing

Ting LIANG1... Wangwang LI2,3,*, Cheng LEI1, Yongwei LI1, Zhiqiang LI1 and Jijun XIONG1 |Show fewer author(s)
Author Affiliations
  • 1Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Taiyuan 030051, China
  • 2Department of Physics, Taiyuan Normal University, Jinzhong 030619, China
  • 3Institute of Computational and Applied Physics, Taiyuan Normal University, Jinzhong 030619, China
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    Ting LIANG, Wangwang LI, Cheng LEI, Yongwei LI, Zhiqiang LI, Jijun XIONG. All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing[J]. Photonic Sensors, 2022, 12(2): 130

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    Paper Information

    Category: Regular

    Received: Jan. 27, 2021

    Accepted: Jul. 2, 2021

    Published Online: Jan. 10, 2022

    The Author Email: LI Wangwang (18434365707@163.com)

    DOI:10.1007/s13320-021-0640-7

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology