Photonic Sensors, Volume. 12, Issue 2, 130(2022)

All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing

Ting LIANG1, Wangwang LI2,3、*, Cheng LEI1, Yongwei LI1, Zhiqiang LI1, and Jijun XIONG1
Author Affiliations
  • 1Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Taiyuan 030051, China
  • 2Department of Physics, Taiyuan Normal University, Jinzhong 030619, China
  • 3Institute of Computational and Applied Physics, Taiyuan Normal University, Jinzhong 030619, China
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    This paper presents an all-SiC fiber-optic Fabry-Perot (FP) pressure sensor based on the hydrophilic direct bonding technology for the applications in the harsh environment. The operating principle, fabrication, interface characteristics, and pressure response test of the proposed all-SiC pressure sensor are discussed. The FP cavity is formed by hermetically direct bonding of two-layer SiC wafers, including a thinned SiC diaphragm and a SiC wafer with an etched cavity. White light interference is used for the detection and demodulation of the sensor pressure signals. Experimental results demonstrate the sensing capabilities for the pressure range up to 800 kPa. The all-SiC structure without any intermediate layer can avoid the sensor failure caused by the thermal expansion coefficient mismatch and therefore has a great potential for pressure measurement in high temperature environments.

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    Ting LIANG, Wangwang LI, Cheng LEI, Yongwei LI, Zhiqiang LI, Jijun XIONG. All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing[J]. Photonic Sensors, 2022, 12(2): 130

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    Paper Information

    Category: Regular

    Received: Jan. 27, 2021

    Accepted: Jul. 2, 2021

    Published Online: Jan. 10, 2022

    The Author Email: LI Wangwang (18434365707@163.com)

    DOI:10.1007/s13320-021-0640-7

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