[1] [1] GUO X G, ZHAI C H, ZHANG L, et al.. Nano-processing performance of optical glass ［J］.Opt. Precision Eng., 2014, 22(11): 2959-2966. (in Chinese)

[2] [2] ZHOU L, DAI Y F, XIE X H, et al.. Material removal property in ion figuring process for optical component ［J］. Opt. Precision Eng., 2007, 15(2): 160-166. (in Chinese)

[3] [3] ZHANG F, ZHANG B ZH. Nano-processing performance of optical glass ［J］.Opt. Precision Eng., 2014, 22(11): 2959-2966. (in Chinese)

[4] [4] YAO P, YOSHIHARA N, HITOMI N, et al.. Ductile and brittle mode grinding of fused silica［J］. Key Engineering Materials, 2010, 447-448: 21-25.

[5] [5] GROSS T M, TOMOZAWA M. Crack-free high load Vickers indentation of silica glass［J］.Journal of Non-Crystalline Solids, 2008, 354(354): 5567-5569.

[6] [6] BIFANO T G, DOW T A, SCATTERGOOD R O. Ductile-regime grinding: a new technology for machining brittle materials［J］.Journal of Engineering for Industry, 1991, 113(2): 184-189.

[7] [7] ZHAO Q, LIANG Y, STEPHENSON D, et al.. Surface and subsurface integrity in diamond grinding of optical glasses on Tetraform‘C’［J］. International Journal of Machine Tools & Manufacture, 2007, 47(14): 2091-2097.

[8] [8] ZHAO Q L, ZHAO L L, WANG Y, et al.. High efficient precision conditioning of the electroplated diamond wheel and grinding of fused silica glasses ［J］. Chinese Journal of Mechanical Engineering, 2013, 49(23): 174-181. (in Chinese)

[9] [9] QIU ZH J, YI P, LU C, et al.. Mechanical property analysis of modified auartz glass［J］. Journal of Materials Science & Engineering, 2013, 26(5): 982-987.(in Chinese)

[10] [10] DAVID B M, BRIAN R L, ROBERT F C. Microstructural effects on grinding of alumina and glass-ceramics ［J］. Journal of the American Ceramic Society, 2005, 70(6): C-139-C-140.

[11] [11] MICHEL M D, SERBENA F C, LEPIENSKI C M. Effect of temperature on hardness and indentation cracking of fused silica ［J］. Journal of Non-Crystalline Solids, 2006, 352(s 32-35): 3550-3555.

[12] [12] BEI J Y. Analysis and investigation of the grinding temperature ［J］.Journal of Shanghai Jiaotong University, 1964, 9: 55-71.(in Chinese)

[13] [13] LI L, FU J, PEKLENIK J. A study of grinding force mathematical model ［J］.CIRP Annals - Manufacturing Technology, 1980, 29(1): 245-249.

[14] [14] XIE G ZH, SHANG ZH T, SHENG X M, et al.. Grinding force modeling for high-speed deep grinding of engineering ceramics ［J］. Chinese Journal of Mechanical Engineering, 2011, 47(11): 169-176. (In Chinese)

[15] [15] REN J X, HUA A D, et al.. Grinding Theory ［M］. Version 2, Xian: Northwestern Polytechnic University Press, 1988: 39. (in Chinese)

[16] [16] GUO C, MALKIN S. Analysis of transient temperatures in grinding ［J］.Journal of Engineering for Industry, 1995, 117(4): 571-577.

[17] [17] ROWE W B, PETTIT J A, BOYLE A, et al.. Avoidance of Thermal Damage in Grinding and Prediction of the Damage Threshold ［J］. CIRP Annals - Manufacturing Technology, 1988, 37(1): 327-330.

[18] [18] ZHANG W X, LU J B. Review on synthesis, properties and application of CBN based materials ［J］.Journal of Zhongyuan University of Technology, 2011, 22(2): 25-28.(in Chinese)