Optics and Precision Engineering, Volume. 31, Issue 24, 3559(2023)

Influence of water in magnetic compound fluid on polishing performance

Youliang WANG1...4,*, Xichun GAO1, Wenjuan ZHANG2, and Jiang GUO34 |Show fewer author(s)
Author Affiliations
  • 1School of Mechanical and Electrical Engineering, Lanzhou University of Technology, Lanzhou730000, China
  • 2State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou730000, China
  • 3School of Mechanical Engineering, Dalian University of Technology, Dalian116024, China
  • 4Ningbo Institute of Dalian University of Technology, Ningbo315016, China
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    Figures & Tables(14)
    Schematic diagram of MCF polishing device
    Polishing device of MCF polishing process
    Images of polished surface and measured infrared temperature
    Surface roughness, decline rate and material removal change with time
    MCF morphologies of different water content before and after polishing
    Variation of polishing temperature with time for different components of MCF
    Normal force of MCF with different water content over time
    Formation mechanism of clustered structures with different water content
    Changes of surface roughness, decline rate and material removal with polishing time
    Morphologies of MCF2 at different polishing time with supplying water
    Polishing temperature variation of MCF over time with supplementary water
    Normal force variation of MCF over time with supplementary water
    • Table 1. Experimental parameters

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      Table 1. Experimental parameters

      ParametersWorkpiece,L×W×tMagnetMagnet eccentricity, rMagnet rotational speed, nmPolishing head rotational speed, ncVolume of MCF slurry supplied, VWorking gap, Polishing time, t
      ValuePMMA:70 mm×70 mm×1 mmNdFeB N52: Φ 20 mm×h 10 mmB=0.5 T4 mm600 r/m500 r/m1 mL1 mm10 min
    • Table 2. MCF component

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      Table 2. MCF component

      MCF slurry(Water content)MF(~10 nm)CIP(~7 μm)Al2O3(~1 μm)α-cellulose
      MCF 1 (40 wt.%)40.8 wt.%44.2 wt.%12 wt.%3 wt.%
      MCF 2 (45 wt.%)45.9 wt.%39.1 wt.%12 wt.%3 wt.%
      MCF 3 (50 wt.%)51 wt.%34 wt.%12 wt.%3 wt.%
      MCF 4 (55 wt.%)56.1 wt.%28.9 wt.%12 wt.%3 wt.%
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    Youliang WANG, Xichun GAO, Wenjuan ZHANG, Jiang GUO. Influence of water in magnetic compound fluid on polishing performance[J]. Optics and Precision Engineering, 2023, 31(24): 3559

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    Paper Information

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    Received: Jul. 13, 2023

    Accepted: --

    Published Online: Jan. 5, 2024

    The Author Email: WANG Youliang (wangyouliang20@163.com)

    DOI:10.37188/OPE.20233124.3559

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