[1] [1] CHENG L, LI CH M, WANG ZH Y.The measures of new technology & development in IC industrial chain［J］.Semiconductor Technology,2004,29(6):57-63.(in Chinese)

[2] [2] HO M T.Microelectronics packaging: present and future［J］.Materials Chemistry and Physics,1995,40:147-161.

[3] [3] WANG H SH, XIONG F, SHI T L.New algorithm for fast and precise localization of machine vision［J］.Opto-Electronic Engineering,2005,32(9):71-74.(in Chinese)

[4] [4] WANG X J, WANG F.Study of micro mechanical size inspection technology by microscope precision digital image［J］.Opt.Precision Eng., 2001,19(6):511-513.(in Chinese)

[5] [5] WU J G, BIN H Z.Dimensional inspecting system of thin sheet parts based on machine vision［J］.Opt.Precision Eng., 2007,15(1):124-130.(in Chinese)

[6] [6] TSAI R.A versatile camera calibration technique for high-accuracy 3D machine vision metrology using off-the-shelf TV cameras and lenses［J］.IEEE Journal of Robotics and Automation,1987,3(4):323-344.

[7] [7] ZHANG Z Y.A versatile camera calibration technique for high-accuracy 3D machine vision metrology using off-the-shelf TV cameras and lenses［J］.IEEE Computer Vision,1999,32(9):666-673.

[8] [8] CHATTERJEE C, ROYCHOWDHOURY V P.Algorithm for coplanar camera calibration［J］.Machine Vision,2000,4(12):87-97.

[9] [9] ZHOU F Q, ZHU J G, YANG X Y, et al..A high speed CCD camera calibration technique［J］.Opt.Precision Eng., 2000,8(1):96-100.(in Chinese)

[10] [10] BROWN L.A survey of image registration techniques［J］.ACM Computing Surveys,1992,24(4): 325-376.

[11] [11] BIAN ZH Q, ZHANG X G.Pattern Recognition［M］.2nd ed.Beijing: Tsinghua University Press, 2000.(in Chinese)

[12] [12] YU D Y, TAN H Y.Engineering Optics［M］.Beijing: China Machine Press, 2003.(in Chinese)