[1] [1] WANG Z Q.The Design and Fabrication of Single-order Diffraction Grating[D].Changchun:Changchun University of Science and Technology,2013.(In Chinese)

[2] [2] ZHUO L X,TANG W,DAI Y,et al..Influence of sub-wavelength aluminum gratings film thickness on infrared reflectivity[C].Proceedings of the 7th China functional materials and applications of academic(volume 2),2010,296-298.(in Chinese)

[3] [3] ZHENG G G,CHEN Y Y,XU L H,et al..Fabrication and application of high aspect ratio metallic gratings for sensing in the mid-infrared region[J].Journal of Infrared and Millimeter Waves,2013,32(2):154-159.(in Chinese)

[4] [4] LI CH B.Process Study of Metal Micro Devices Fabricated by Copper or Nickel Electroforming[D].Dalian:Dalian University of Technology,2013.(in Chinese)

[5] [5] DU L Q,LI CH B,LI Y H,et al..Application of ultrasonic stress relief technology to microinjection mold fabrication[J].Opt.Precision Eng.,2012,20(6):1250-1256.(in Chinese)

[6] [6] WOURTERS K,PUERS R.Diffusing and swelling in SU-8:insight in material properties and processing[J].J.Micromech.Microeng,2010,20(9):1-10.

[7] [7] JIN P,JIANG K,SUN N J.Micro fabrication of ultra-thick SU-8 photoresist for micro engines[C].Micromachining and Microfabrication.International Society for Optics and Photonics,2003,105-110.

[8] [8] DU L Q,ZHU SH M,LIU CH.Study on the thermal swelling of SU-8 photoresist in UV-LIGA technique[J].Piezoelectrics and Acoustooptics,2008,30(5):621-623.(in Chinese)

[9] [9] DU L Q,LIU Y P,LI Y H,et al..Effect of ultrasonic treatment on SU-8 swelling in UV-LIGA technology[J].Opt.Precision Eng.,2012,20(9):2006-2013.(in Chinese)

[10] [10] DU L Q,ZHU SH M,YU L CH.Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist[J].Opt.Precision Eng.,2008,16(3):500-504.(in Chinese)

[11] [11] LEE M C,PEPPAS N A.Models of moisture transport and moisture-induced stresses in epoxy composites[J].Journal of Composite Materials,1993,27(12):1146-1171.

[12] [12] Du L Q,Li Y H,Liu J F.Influence of current density on the interfacial bond strength of electroformed layers[J].Micro and Nano Letters,2012,7(5):402-406.

[13] [13] SHAO L G,DU L Q,WANG L D.Electrochemical activation of substrate surfaces in micro-electroforming[J].Micro and Nano Letters,2013,8(12):872-876.

[14] [14] XIAO R S,DU L Q,LIU H J,et al..Research on phenomenon of hydrogen evolution in micro-electroforming[J].Chinese Journal of Mechanical Engineering,2005(z1):446-448.(in Chinese)