International Journal of Extreme Manufacturing, Volume. 4, Issue 3, 32001(2022)

Optical wafer defect inspection at the 10 nm technology node and beyond

Jinlong Zhu1,*... Jiamin Liu1, Tianlai Xu2, Shuai Yuan2, Zexu Zhang2, Hao Jiang1, Honggang Gu1, Renjie Zhou3 and Shiyuan Liu1 |Show fewer author(s)
Author Affiliations
  • 1State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, People’s Republic of China
  • 2School of Astronautics, Harbin Institute of Technology, Harbin 150001, People’s Republic of China
  • 3Department of Biomedical Engineering, The Chinese University of Hong Kong, Shatin, New Territories, Hong Kong SAR, People’s Republic of China
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    Jinlong Zhu, Jiamin Liu, Tianlai Xu, Shuai Yuan, Zexu Zhang, Hao Jiang, Honggang Gu, Renjie Zhou, Shiyuan Liu. Optical wafer defect inspection at the 10 nm technology node and beyond[J]. International Journal of Extreme Manufacturing, 2022, 4(3): 32001

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    Paper Information

    Category: Topical Review

    Received: Jan. 21, 2022

    Accepted: --

    Published Online: Jan. 23, 2023

    The Author Email: Zhu Jinlong (jinlongzhu03@hust.edu.cn)

    DOI:10.1088/2631-7990/ac64d7

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