Optics and Precision Engineering, Volume. 30, Issue 14, 1704(2022)
Material removal and surface damage behavior of diamond grain for flexible scribing RB-SiC
Figures & Tables(13)
Fig. 2. Scribing experiment platform and schematic diagram of flexible scribing
Fig. 9. Influence curve of normal pressure and three-dimensional topographies the scratch
Fig. 10. SEM images of scratched surface， tangential force and damage influence curves
Table 1. Orthogonal experiment parameter table
View tableView in ArticleTable 1. Orthogonal experiment parameter table
参数 数值 磨粒角度/（°） 80、100、120 刻划速度/（mm·s-1） 0.4、0.8、1.2 法向压力/N 5、10、15 刻划长度/mm 10
Table 2. Orthogonal experimental results
View tableView in ArticleTable 2. Orthogonal experimental results
Item Abrasive angle/（°） Scribing speed/（mm·s-1） Normal force/N ACL/μm SFD/μm 1 80 0.4 5 3.55 23.7 2 80 0.8 10 5.08 29.3 3 80 1.2 15 14.92 45.85 4 100 0.4 10 6.12 29.91 5 100 0.8 15 9.6 33.44 6 100 1.2 5 4.25 18.55 7 120 0.4 15 6.38 29.36 8 120 0.8 5 4.10 22.28 9 120 1.2 10 4.20 27.5 △L k1 7.851 5.347 3.97 k2 6.656 6.26 5.13 k3 4.291 7.789 10.3 R 3.56 2.442 6.33 k1 32.95 27.66 21.51 △H k2 27.3 30.7 28.9 k3 26.38 30.6 36.18 R 6.57 3.04 14.67
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Yaru WANG, Yingjie LI, Lai ZOU, Congcong HAN, Yutong LI. Material removal and surface damage behavior of diamond grain for flexible scribing RB-SiC[J]. Optics and Precision Engineering, 2022, 30(14): 1704
Paper Information
Category: Micro/Nano Technology and Fine Mechanics
Received: Apr. 18, 2022
Accepted: --
Published Online: Sep. 6, 2022
The Author Email: ZOU Lai (zoulai@cqu.edu.cn)
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