Optics and Precision Engineering, Volume. 29, Issue 12, 2877(2021)
Design and analysis of the repeatable development and collapse mechanism film protective cover of space camera
Fig. 2. Development and collapse process of the deployable development and collapse mechanism
Fig. 6. Relationship between the outer envelope radius and the number of edges at different heights
Fig. 7. Relationship between the outer envelope radius and the number of edges at different inner envelope radius
Fig. 9. Relationship between the radial expansion and collapse ratio and the angle
Fig. 10. Relationship between the axial expansion and collapse ratio and the angle
Fig. 13. Relationship between rods temperature and time without protective cover
Fig. 14. Relationship between rods temperature and time with protective cover
Fig. 15. Internal temperature nephogram of mechanism under high temperature condition
Fig. 16. Axial temperature distribution of rods under high temperature condition
Fig. 17. Internal temperature nephogram of the mechanism under low temperature condition
Fig. 18. Axial temperature distribution of rods under low temperature condition
Fig. 19. Axial deformation value of the main mirror mounting ring surface under high temperature condition
Fig. 20. Deformation of the main mirror mounting ring surface under high temperature condition
Fig. 21. Axial deformation value of the main mirror mounting ring surface under low temperature condition
Fig. 22. Deformation of the main mirror mounting ring surface at low temperature condition
Fig. 23. Deformation and configuration changes of primary mirror mounting surface
Fig. 24. Deformation and configuration changes of primary mirror mounting surface
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Hong XIAO, Hong-yang WANG, Hong-wei GUO, Sai ZHANG, Rong-qiang LIU, Bin FAN, Jiang BIAN. Design and analysis of the repeatable development and collapse mechanism film protective cover of space camera[J]. Optics and Precision Engineering, 2021, 29(12): 2877
Category: Micro/Nano Technology and Fine Mechanics
Received: May. 10, 2021
Accepted: --
Published Online: Jan. 20, 2022
The Author Email: GUO Hong-wei (guohw@hit.edu.cn)