High Power Laser and Particle Beams, Volume. 31, Issue 8, 83102(2019)

Study of current density distribution in terahertz device micro-electroforming process

Zhao Xinyue1...2,*, Ji Shengwei1,2, Lu Yiru3, Liu Yubao1,4, Huang Bo1,2, and Wang Xiaokang12 |Show fewer author(s)
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    References(4)

    [4] [4] Li Hanyan, Li Yongtao, Feng Jinjun. Fabrication of 340-GHz folded waveguides using KMPR photoresist[J]. IEEE Electron Device Letters, 2013, 34(3): 462-464.

    [5] [5] Joye C D, Calame J P, Cook A M, et al. High-power copper gratings for a sheet-beam traveling-wave amplifier at G-band[J]. IEEE Trans Electrons Devices, 2013, 60(1): 506-509.

    [6] [6] Chen K W, Wang Y L, Chang L, et al. Investigation of overpotential and seed thickness on Damascene copper electroplating[J]. Surface & Coatings Technology, 2006, 200(10): 3112-3116.

    [7] [7] Yang H, Kang S W. Improvement of thickness uniformity in nickel electro-forming for the LIGA process[J]. International Journal of Machine Tools &Manufacture, 2000, 40(7): 1065-1072.

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    Zhao Xinyue, Ji Shengwei, Lu Yiru, Liu Yubao, Huang Bo, Wang Xiaokang. Study of current density distribution in terahertz device micro-electroforming process[J]. High Power Laser and Particle Beams, 2019, 31(8): 83102

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    Paper Information

    Category: terahertz technology

    Received: Mar. 8, 2019

    Accepted: --

    Published Online: Jul. 25, 2019

    The Author Email: Xinyue Zhao (zhaoxinyue@mail.hfut.edu.cn)

    DOI:10.11884/hplpb201931.190067

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