Infrared and Laser Engineering, Volume. 51, Issue 3, 20210133(2022)
Research on local delamination failure mechanism of InSb infrared focal plane arrays detector
Figures & Tables(8)
Fig. 1. Schematic diagram of three typical crack expanding mode. (a) Mode I crack(opening mode); (b) Mode II crack(sliding mode); (c) Mode III crack(tearing type)
Fig. 2. Diagram of bilinear traction-separation rule of cohesive zone modeling
Fig. 4. Simulated results for displacement vector sum vs. the measured photograph of InSb IRFPAs detector after the liquid nitrogen shock
Fig. 5. Local delamination position under different mixed-mode ratios
Fig. 6. Local delamination occupying width under different mixed-mode ratios
Table 1. Parameter setting of cohesive zone modeling under different mixed-mode ratios
View tableView in ArticleTable 1. Parameter setting of cohesive zone modeling under different mixed-mode ratios
Mixed-mode ratios, ω Normal cohesive traction Normal displacement jump Tangential cohesive traction Tangential displacement jump σ 0/kPa δI0/mm τ0/kPa δII0/mm 9∶1 116.7 1 1050 1 8∶2 257.2 1 1029 1 7∶3 414 1 975 1 6∶4 583.5 1 882.6 1 5∶5 750 1 750 1 4∶6 882.6 1 583.5 1 3∶7 975 1 414 1 2∶8 1029 1 257.2 1 1∶9 1050 1 116.7 1
Table 2. Related material parameters of InSb IRFPAs
View tableView in ArticleTable 2. Related material parameters of InSb IRFPAs
Materials Elastic modulus, E/GPa Poison’s ratio, μ Temperatures, T/K $\alpha = 22.46 \times {10^{ - 6}} + 5.04 \times {10^{ - 8}} \times {\rm{(}}T{\rm{ - }}273{\rm{)}}$ InSb chip 409(in plane) 123(out of plane) 0.35 77–300 Underfill 0.0002/α 0.30 77–300 Silicon ROIC 163 0.28 77–300
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Jiangfeng Zhang, Xiaohan Tian, Xiaoling Zhang, Qingduan Meng. Research on local delamination failure mechanism of InSb infrared focal plane arrays detector[J]. Infrared and Laser Engineering, 2022, 51(3): 20210133
Paper Information
Category: Infrared technology and application
Received: Mar. 4, 2021
Accepted: --
Published Online: Apr. 8, 2022
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