Infrared and Laser Engineering, Volume. 51, Issue 3, 20210133(2022)

Research on local delamination failure mechanism of InSb infrared focal plane arrays detector

Jiangfeng Zhang1, Xiaohan Tian1, Xiaoling Zhang2, and Qingduan Meng1
Author Affiliations
  • 1School of Electrical Engineering, Henan University of Science and Technology, Luoyang 471023, China
  • 2School of Software, Henan University of Science and Technology, Luoyang 471023, China
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    Figures & Tables(8)
    Schematic diagram of three typical crack expanding mode. (a) Mode I crack(opening mode); (b) Mode II crack(sliding mode); (c) Mode III crack(tearing type)
    Diagram of bilinear traction-separation rule of cohesive zone modeling
    Two-dimensional finite element model for InSb IRFPAs
    Simulated results for displacement vector sum vs. the measured photograph of InSb IRFPAs detector after the liquid nitrogen shock
    Local delamination position under different mixed-mode ratios
    Local delamination occupying width under different mixed-mode ratios
    • Table 1. Parameter setting of cohesive zone modeling under different mixed-mode ratios

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      Table 1. Parameter setting of cohesive zone modeling under different mixed-mode ratios

      Mixed-mode ratios, ωNormal cohesive tractionNormal displacement jumpTangential cohesive tractionTangential displacement jump
      σ 0/kPa δI0/mm τ0/kPa δII0/mm
      9∶1116.7110501
      8∶2257.2110291
      7∶341419751
      6∶4583.51882.61
      5∶575017501
      4∶6882.61583.51
      3∶797514141
      2∶810291257.21
      1∶910501116.71
    • Table 2. Related material parameters of InSb IRFPAs

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      Table 2. Related material parameters of InSb IRFPAs

      MaterialsElastic modulus, E/GPa Poison’s ratio, μTemperatures, T/K
      $\alpha = 22.46 \times {10^{ - 6}} + 5.04 \times {10^{ - 8}} \times {\rm{(}}T{\rm{ - }}273{\rm{)}}$, K是开式温度单位
      InSb chip409(in plane) 123(out of plane) 0.3577–300
      Underfill0.0002/α0.3077–300
      Silicon ROIC1630.2877–300
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    Jiangfeng Zhang, Xiaohan Tian, Xiaoling Zhang, Qingduan Meng. Research on local delamination failure mechanism of InSb infrared focal plane arrays detector[J]. Infrared and Laser Engineering, 2022, 51(3): 20210133

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    Paper Information

    Category: Infrared technology and application

    Received: Mar. 4, 2021

    Accepted: --

    Published Online: Apr. 8, 2022

    The Author Email:

    DOI:10.3788/IRLA20210133

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