Study On Optical Communications, Volume. 51, Issue 1, 230172-01(2025)

Thermal Simulation and Experimental Study of QSFP+ Optical Modules

Jiandong MAO*, Guohua XIAO, and Zijun ZHENG
Author Affiliations
  • College of Electromechanical Engineering, Zhejiang Institute of Business and Technology, Ningbo 315000, China
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    Figures & Tables(10)
    The 3D model of optical module
    Main chip locations and power consumption on the the PCB
    Numerical wind tunnel model
    Overall temperature field distribution of optical module
    Actual test plan
    Schematic diagram of the measured structure
    The physical diagram of the experiment
    Comparison of simulation and measured data
    Comparison of simulated temperature rise and measured temperature rise
    • Table 1. Material properties

      View table
      View in Article

      Table 1. Material properties

      材料导热系数/W/m·K电阻率/Ω·m
      上盖、下盖111.08.60×10-8
      散热器218.0 
      芯片117.5(100 ℃)2.93×103
      散热片6.5 
      PCB水平:30.0;垂直:0.5 
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    Jiandong MAO, Guohua XIAO, Zijun ZHENG. Thermal Simulation and Experimental Study of QSFP+ Optical Modules[J]. Study On Optical Communications, 2025, 51(1): 230172-01

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    Paper Information

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    Received: Nov. 23, 2023

    Accepted: --

    Published Online: Feb. 24, 2025

    The Author Email: MAO Jiandong (809286534@qq.com)

    DOI:10.13756/j.gtxyj.2025.230172

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