In order to study the temperature distribution and airflow requirements of high-speed optical modules, aiming to optimize the heat dissipation design and ensure the stable operation of optical modules.

The article adopts Flotherm simulation analysis to establish the numerical wind tunnel model of the optical module. The temperature distribution of each component during normal operation is obtained. The working air flow of the fan is also obtained when the system is stabilized, which are in line with the heat dissipation requirements in the specification of Multi-Source Agreement (MSA). In order to facilitate the testing and installation, the”L”type wind tunnel fixture is designed. The actual surface temperature of each chip and the actual working wind flow rate of the wind tunnel are tested experimentally to verify the accuracy of the simulation results.

The results show that in the case of the maximum temperature of 70 ℃, for the surface temperature of each chip, the difference between the simulation and the measured temperature is less than 2 ℃, with an error of less than 5%. For the airflow rate required for the heat dissipation of the entire optical module, the difference between the simulation and measured results is 0.2 Cubic Feet per Minute (CFM), with an error within 7%.

It can be shown that the simulation and measurement methods are feasible and the error is small, which provides an important reference value in the design and testing of heat dissipation of high-speed optical modules.