Semiconductor Optoelectronics, Volume. 41, Issue 3, 379(2020)
Warpage Control and Correction of InP Wafer in Back-thinning Process
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ZHANG Yuanyuan, LIU Cong, ZHAO Wenbo, MO Caiping, DONG Xufeng, HUANG Yulan, LIANG Xingyu, DUAN Lihua, TIAN Kun, ZHANG Hongbo. Warpage Control and Correction of InP Wafer in Back-thinning Process[J]. Semiconductor Optoelectronics, 2020, 41(3): 379
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Received: Jan. 16, 2020
Accepted: --
Published Online: Jun. 18, 2020
The Author Email: Yuanyuan ZHANG (cqzl327@163.com)
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