Opto-Electronic Engineering, Volume. 32, Issue 3, 17(2005)

[in Chinese]

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[4] [4] BO Zhou. Thermal analysis of hot plate resist baking using a lumped capacitance model [J]. SPIE,1999,3677:754-759.

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[in Chinese], [in Chinese], [in Chinese]. [J]. Opto-Electronic Engineering, 2005, 32(3): 17

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Received: Jun. 25, 2004

Accepted: --

Published Online: Nov. 14, 2007

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