[1] [1] GUO X G, QU CH H, ZHANG L, et al.. Nano-processing performance of optical glass［J］. Opt. Precision Eng., 2014, 22(11): 2959-2966.(in Chinese)

[2] [2] WU CH H, GUO B, YAO G, et al.. The chemical mechanical polishing technology research of the hard and brittle materials ［J］. Machinery Design & Manufacture, 2014, 2(2): 37-39.(in Chinese)

[3] [3] LEE H S, JEONG H D, DORNFELD. Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing(CMP) processes ［J］. Precision Engineering, 2013, 37: 483-490.

[4] [4] ZHAO Y W, CHANG L, KIM S H. A mathematical model for chemical-mechanical polishing based on formation and removal of weakly bonded molecular species ［J］. Wear, 2003, 254(3): 332-339.

[5] [5] HOCHENG H, TSAI H Y, SUB Y T. Modeling and experimental analysis of material removal rate in the chemical mechanical planarization of dielectric films and brare silicon wafers ［J］. Electt. Dchem. Soc., 2001, 148(10): 581-586.

[6] [6] GUO D M, LIU R H, KANG R K. Sudy on adhesion removal model in CMP SiO2 ILD ［J］. Key Engineering Materials, 2008, 759(389): 475-480.

[7] [7] WANG Y G, ZHAO Y W. Research on the molecular scale removal mechanism in chemical mechanical polishing ［J］. Chinese Science Bulletin, 2008, 53(13): 2084-2089.

[8] [8] ZHANG P ZH, LEI H, ZHANG J P, et al.. Preparation of nano-sized CeO2 and its polishing performances ［J］. Optical Technique, 2006, 32(5): 1-4.

[9] [9] CHEN Y, LU J X, CHEN Z G. Preparation, characterization and oxide CMP performance of composite polystyrene-core ceria-shell abrasives ［J］. Microelectronic Engineering, 2011, 88(2): 200-205.

[10] [10] LUO J F, DORNFELD D A. Material removal mechanism in chemical mechanical polishing: theory and modeling ［J］. IEEE Trans. Semicond. Manuf., 2001, 14: 112-133.

[11] [11] VALENTIN L, POPOV. Contact Mechanics and Friction Physical Principles and Applications ［M］. Beijing: Tsinghua University Press, 2011.

[12] [12] WANG Y G, ZHAO Y W, GU J. A new nonlinear-micro-contact model for single particle in the chemical-mechanical polishing with soft pad ［J］. Journal of Materials Processing Technology, 2007(183): 374-379.

[13] [13] WANG Y G. Experimental and Theoretical Study on the Material Removal Mechanism in the Chemical Mechanical Polishing at Molecular Scale ［D］.Wuxi: Jiangnan University, 2008.(in Chinese)

[14] [14] GU X, ZHANG CH H, LUO J B, et al.. Research on polishing end face of silica optical fiber ［J］. Chinese Journal of Tribology, 2008, 28(1): 11-17.(in Chinese)

[15] [15] ZHOU Y H. Study on the Hydroxy of Fused Glass and Raw Materials ［D］. Beijing: China Building Materials Academy, 2002.(in Chinese)

[16] [16] SU J X.Study on Material Removal Mechanism of Wafer Chemical Mechanical Polishing in IC Manufacturing ［D］. Dalian: Dalian University of Technology, 2006.(in Chinese)

[17] [17] LI Y T. The Theory and Application of Mechanical Vibration ［M］. Beijing: Science Press, 2012.(in Chinese)

[18] [18] CHOU ZH J, ZHOU L B, FANG F ZH, et al.. Chemical mechanical grinding for fused glass ［J］. Opt. Precision Eng., 2010, 18(7): 1554-1560.(in Chinese)

[19] [19] XU Y.Chemical Reaction Dynamics ［M］. Beijing: Chemical Industry Press, 2005.(in Chinese)

[20] [20] ZHONG K L. A Course in Probability Theory ［M］. Beijing: China Machine Press, 2001.(in Chinese)

[21] [21] JI SH M, LI CH, TAN D P, et al.. Study on machinability of softness abrasive flow based on Preston equation ［J］. Chinese Journal of Mechanical Engineering, 2011, 47(17): 156-163.(in Chinese)