Preparation of Cut-off Filter of Infrared Penetration Based on 4.0~4.8 pm

ZHANG Xiang; ZHANG Wei

Electro-Optic Technology Application, Volume. 39, Issue 2, 21(2024)

ZHANG Xiang and ZHANG Wei

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References(2)

[6] [6] MOORE T D, JARVIS J L. The peeling moment-a key rule delamination resistance in IC assemblies ASME[J].Electron Packaging, 2004, 126(1): 106-109.

[7] [7] CHAPMAN B N. Thin-film adhesion[J]. Journal of Vacuum Science & Technology, 1974, 11: 106-113.

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ZHANG Xiang, ZHANG Wei. Preparation of Cut-off Filter of Infrared Penetration Based on 4.0~4.8 pm[J]. Electro-Optic Technology Application, 2024, 39(2): 21

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