Infrared and Laser Engineering, Volume. 51, Issue 12, 20220141(2022)

Study on proton implantation isolation of GaAs-based devices

Mengya Zong1, Jingjing Dai1、*, Wei Li1, Congyang Wen2, Tong Zhang1, and Zhiyong Wang1,2
Author Affiliations
  • 1Department of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China
  • 2Institute of Atomic and Molecular Science, Shaanxi University of Science & Technology, Xi’an 710021, China
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    Figures & Tables(10)
    Average range distribution curve of proton during H+ ion implantation with different energy
    (a) Proton concentration distribution curve during H+ ion implantation with different energy; (b) Proton concentration distribution curve depth during H+ ion implantation with different dose
    Lattice (a) local defects and (b) a large number of defect clusters produced by ion collision
    Epitaxial structure of VCSEL
    Proton implantation process diagram
    (a) The ombardment process and (b) the range distribution of 400 keV H+ ions
    SEM images under the injection conditions of (a) 280 keV,6×1014 cm−2; (b) 400 keV,2×1015 cm−2; (c) 320 keV,8×1014 cm−2 and (d) 360 keV,6×1014 cm−2
    Vriation curve of resistance value with injection dose
    P-I-V curve and the near field distribution of VCSEL at injection parameters: 320 keV, 8×1014cm−2
    • Table 1. Characterization results of SEM

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      Table 1. Characterization results of SEM

      GroupEnergy/ keV Dose/ cm−2Average range, $ {R_P} $/μm Junction depth, $ {\text{2}}\Delta {R_P} $/μm Distance from active region, d/μm
      12806×10141.550.351.28
      23206×10141.670.611.03
      33208×10141.670.730.97
      43201×10151.680.840.9
      53202×10151.701.070.77
      63606×10141.720.710.93
      74002×10152.231.30
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    Mengya Zong, Jingjing Dai, Wei Li, Congyang Wen, Tong Zhang, Zhiyong Wang. Study on proton implantation isolation of GaAs-based devices[J]. Infrared and Laser Engineering, 2022, 51(12): 20220141

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    Paper Information

    Category: Materials & Thin films

    Received: Mar. 4, 2022

    Accepted: --

    Published Online: Jan. 10, 2023

    The Author Email:

    DOI:10.3788/IRLA20220141

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