Study On Optical Communications, Volume. 46, Issue 4, 58(2020)
Study on Reliability of Photoelectric Structure in Flexible Printed Circuit Board under Thermal Stress
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NIE Guo-jian, YU Di, LEI Ting, LI Xin-rong, YANG Yun. Study on Reliability of Photoelectric Structure in Flexible Printed Circuit Board under Thermal Stress[J]. Study On Optical Communications, 2020, 46(4): 58
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Received: Dec. 18, 2019
Accepted: --
Published Online: Nov. 2, 2020
The Author Email: Di YU (cc499798804@163.com)
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