[1] [1] EVANS D D, BOK Z. AuSi and AuSn eutectic die attach case studies from small (12 mil) to large (453 mil) die ［C］ // International Symposium on Microelectronics. 2010: 276-283.

[2] [2] TOLLEFSEN T A, LARSSON A, LVVIK O M, et al. High temperature interconnect and die attach technology: Au-Sn SLID bonding ［J］. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3(6): 904-914.

[3] [3] ZHENG P, WIGGINS A, JOHNSON R W, et al. Die attach for high temperature electronics packaging ［C］ // International Conference and Exhibition on High Temperature Electronics. 2008: 120-124.

[4] [4] LING Z, CHING N S, ZHENG L, et al. Development of advanced AuSn alloy plating technology for semiconductor application ［C］ // 15th International Conference on Electronic Packaging Technology. Chengdu, China. 2014: 113-116.

[5] [5] DONG C C, SCHWARZ A, ROTH D V. Effects of atmosphere composition on soldering performance of lead-free alternatives ［C］ // Proceedings of the NEPCON WEST'97. 1997, 1: 211-221.

[6] [6] LAI Y T, LIU C Y. Study of wetting reaction between eutectic AuSn and Au foil ［J］. Jounal of Electronic Materials, 2006, 35(1): 28-34.

[7] [7] DONG C C, SCHWARZ A, ROTH D V. Feasibility of fluxless reflow of lead-free solders in hydrogen and forming gas ［J］. Proceedings of the NEPCON WEST'97. 1997.

[8] [8] DONG M Z, WANG Y M, CAI J, et al. Effects of nitrogen on wettability and reliability of lead-free solder in reflow soldering ［C］ // International Conference on Electronic Packaging Technology & High Density Packaging. Beijing, China. 2009: 147-151.

[9] [9] WANG L J, XUE S B, LIU H. Effect of oxygen content on wettability, microstructure and solder ability of Au-20Sn solders ［J］. Journal of Materials Science: Materials in Electronics, 2018, 29: 21130-21137.

[10] [10] LI Y, WU D, ZHANG Y B, et al. Effects of trace oxygen content on microstructure and performances of Au-20Sn/Cu solder joints ［J］. Crystals, 2021, 11(6): 601-606.

[11] [11] GUI X L, ZHANG Z Y, LIU S, et al. Investigation of reflow soldering under nitrogen atmosphere ［C］ // 13th International Conference on Electronic Packaging Technology & High Density Packaging. Guilin, China. 2012: 861-865.