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Study On Optical Communications, Volume. 47, Issue 3, 48(2021)

Compensation Design of Interconnection Structure in Optical Module

NING Jing1...2, SONG Xiao-ping1,*, LIU Cheng-gang1 and YU Chun-ping1 |Show fewer author(s)
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    [4] [4] Budka T P.Wide-bandwidth Millimeter-wave Bond-wire Interconnects［J］.IEEE Trans.Microw.Theory Tech.,2001,9( 4):715-718.

    [5] [5] Zhang Y P, Li D. Antenna-on Chip and Antenna-in-package Solutions to Highly Integrated Millimeter-wave Devices for Wireless Communications［J］.IEEE Trans. Antenna Propa., 2009,57(10):2830-2841.

    [6] [6] Zhang Y P, Sun M, Chua K M, et al. Antenna-in-package Design for Wirebond Interconnection to Highly Integrated 60 GHz Radios［J］.IEEE Trans.Antenna Propa., 2009, 57(10):2842-2852.

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    NING Jing, SONG Xiao-ping, LIU Cheng-gang, YU Chun-ping. Compensation Design of Interconnection Structure in Optical Module[J]. Study On Optical Communications, 2021, 47(3): 48

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    Received: Nov. 4, 2020

    Accepted: --

    Published Online: Aug. 23, 2021

    The Author Email: Xiao-ping SONG (xiaoping.song@accelink.com)

    DOI:10.13756/j.gtxyj.2021.03.011

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology