Modern Scientific Instruments, Volume. 18, Issue 2, 32(2008)

The Evaluation of Mechanical Properties of Thin Film by Multilayer Microbridge Testing Method

[in Chinese]*... [in Chinese], [in Chinese], [in Chinese] and [in Chinese] |Show fewer author(s)
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    References(6)

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    [2] [2] Zhang T H,Huan Y.Substrate effects on the micm/nanomechanical properties of TiN coatings,Tribiology Letters,2004,17:911-916

    [3] [3] Su Y-J,Qian C-F,Zhao M H,Zhang T Y.Microbridgetesting of silicon oxide/silicon nitride bilayer films deposited on silicon wafers,Acta Mater,2000,48:4901-4915

    [4] [4] Zhou zM,ZhouY,Yang C S,Chen JA,DinsW,DingG F.The evaluation of Youngs modulus and residual stress of copper films by microbridge testing,Sensors and Actuators A:Physical,2006,127,392-397

    [5] [5] Zhou Z,Zhou Y,Wang M,Yang C,Chcn Ji'an,Ding W,Gao X,Zhang TH.Evaluation of Youngg Modulus and Residual Stress of NiFe Film by Micmbridge Testing.Journal of Materials Science & Technology,2006,22:345-348

    [6] [6] S.P.Timoshenko and S.Woinowsky-krieger.Theory of Plates and Shells(second ed.),McGraw-Hill,New York 1959

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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. The Evaluation of Mechanical Properties of Thin Film by Multilayer Microbridge Testing Method[J]. Modern Scientific Instruments, 2008, 18(2): 32

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    Paper Information

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    Received: Oct. 17, 2007

    Accepted: --

    Published Online: Aug. 17, 2008

    The Author Email: (周志敏讲师研究方向:薄膜材料及MEMS器件.Email:zmzhou)

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