Temperature precise control in hot embossing device

[in Chinese]; [in Chinese]; [in Chinese]

Optics and Precision Engineering, Volume. 16, Issue 5, 845(2008)

[in Chinese], [in Chinese], and [in Chinese]

Author Affiliations

[in Chinese]

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References(5)

[1] [1] HECKELE M,SCHOMBURG W K.Review on micro molding of thermoplastic polymers[J].Journal of Micromechanics and Microengineering,2004,20(14):R1-R14.

[2] [2] MEKARU H,GOTO H,TAKAHASHI M.Development of ultrasonic micro hot embossing technology[J].Microelectronic Engineering 2007,84(5):1282-1287.

[4] [4] HYUNG S P,HO H S,MAN Y S,et al..Novel process to improve defect problems for thermal nanoimprint lithography[J].IEEE,2007,20(1):13-19.

[5] [5] VINING C B.Semiconductors are cool[J].Nature,2001,413(6856):577-585.

[6] [6] XUAN X C,NG K C,YAP C,et al..A general model for studying effects of interface layers on thermoelectric devices performance[J].International Journal of Heat and Mass Transfer,2002,45(26):5159-5170.