Fig. 1. (a) Optical microscopy image of a fabricated SBV. The SEM photographs of Schottky metal-brim structure details are added. (b) SBV with Schottky metal-brim. (c) Conventional SBV.

Fig. 2. Energy band diagram of MIS structure.

Fig. 3. (a) Forward I–V characteristics with different structures in log scale (similar with diameter @3 μm). (b) Reverse breakdown characteristics with different structures.

Fig. 4. Comparison of the measured C–V curves of the SMB-SBV structure and simulated curves based on different models.

Fig. 5. Equivalent circuit of the 215 GHz TMIC tripler.

Fig. 6. (a) SEM image of a fabricated tripler TMIC chip. (b) SEM image of a pair of varactors in parallel.

Fig. 7. Photo of test-site about 215 GHz tripler TMIC.

Fig. 8. (a) Measured input and output power as a function of frequency. (b) Measured output power and efficiency as a function of input power at different frequency.

Fig. 9. Comparison of the measured efficiency and simulated curves based on different physics-based C–V models.