Acta Photonica Sinica, Volume. 35, Issue 9, 1325(2006)

Study on the Strain and Temperature Densing Characteristics of FBG Packaged by the Copper slice

Yu Xiujuan1...2,*, Yu Yonglong1,3, Zhang Min2, Liao Yanbiao2 and Lai Shurong2 |Show fewer author(s)
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • show less
    Figures & Tables(0)
    Tools

    Get Citation

    Copy Citation Text

    Yu Xiujuan, Yu Yonglong, Zhang Min, Liao Yanbiao, Lai Shurong. Study on the Strain and Temperature Densing Characteristics of FBG Packaged by the Copper slice[J]. Acta Photonica Sinica, 2006, 35(9): 1325

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category:

    Received: Jun. 13, 2005

    Accepted: --

    Published Online: Jun. 3, 2010

    The Author Email: Xiujuan Yu (xiujuanyu@163.com)

    DOI:

    CSTR:32186.14.

    Topics