Acta Photonica Sinica, Volume. 35, Issue 9, 1325(2006)
Study on the Strain and Temperature Densing Characteristics of FBG Packaged by the Copper slice
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Yu Xiujuan, Yu Yonglong, Zhang Min, Liao Yanbiao, Lai Shurong. Study on the Strain and Temperature Densing Characteristics of FBG Packaged by the Copper slice[J]. Acta Photonica Sinica, 2006, 35(9): 1325
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Received: Jun. 13, 2005
Accepted: --
Published Online: Jun. 3, 2010
The Author Email: Xiujuan Yu (xiujuanyu@163.com)
CSTR:32186.14.