Optics and Precision Engineering, Volume. 24, Issue 10, 2490(2016)
Polishing characteristics of fixed-abrasive pad by using nano-aggregate silica
[1] [1] DINESH CHOPRA.Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper Layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed Abrasive pad[P]. USA: patent disclosure, US6276996B1 2001.
[2] [2] YAGUO LI, YONGBO WU, LIBOZHOU, MASSAKAZU FUJIMOTO.Vibration-assisted dry polishing of fused silica using a fixed-abrasive polisher[J]. International Journal of Machine Tools & Manufacture, 2014, 77 : 93-102.
[3] [3] ZHI CH D,HAO B CH,HON Y T. Further investigations on fixed abrasive diamond Pellets used for diminishing mid-spatial frequency errors of optical mirrors [J].Applied Optics, 2014, 53(3): 327-334.
[4] [4] YUSUKE KOKUBU,YASUHIRO TANI, et al.. Novel non-woven polishing pad impregnated with epoxy resin [C].The 15th International Conference on Precision Engineering,2014: 752-753.
[5] [5] JOHN G. Fixed abrasives and selective chemistries: some real advantages for direct STI CMP[C]. Proceedings of CMP-MIC conference, 2002: 101.
[6] [6] KIM Y, PARK J H, KIM H J, et al..Self-conditioning of encapsulated abrasive pad in chemical polishing [C]. Proceedings of CMP-MIC Conference, 2002: 395-402.
[7] [7] GAO Q,TANI Y,DONG G.Polishing characteristics of micron particles aggregated by nanosilica[J]. Journal of Advanced Mechanical Design,Systems,and Manufacturing, 2015, 9(3): Jamdsm0027.
[8] [8] GAO Q, TANI Y. Development of fixed silica pad[C].Proceedings of the Japan Society for Precision Engineering,Autumn,2001: 406.(in Japanese)
[9] [9] TOSHIYUKI E,TAKAAKI K,et al..Edge finishing of a silicon wafer with a lapping film utilizing agglomerative superfine silica abrasives-Development of a lapping film with high finishing efficiency[J]. Journal of the Japan Society for Abrasive Technology, 2002, 46(9): 458-463.(in Japanese)
[10] [10] PING L,HONG L,RULING C,Polishing properties of porous silica abrasive on hard disk substrate CMP [J]. International Journal abrasive technology, 2010, 3(3): 228-237.
[11] [11] ERIC M, Polishing of silicon [J]. SCP and Solid State Technology, 1967,8: 27-39.
Get Citation
Copy Citation Text
GAO Qi. Polishing characteristics of fixed-abrasive pad by using nano-aggregate silica[J]. Optics and Precision Engineering, 2016, 24(10): 2490
Category:
Received: Apr. 10, 2016
Accepted: --
Published Online: Nov. 23, 2016
The Author Email: