A kind of fixed-abrasive pad by using nano-aggregate silica was proposed to overcome the shortcomings of the pads using conventional silica abrasives on its surface scratch and low removal efficiency. The nano-aggregate silica particles were added into the fixed-silica pad,and the polishing experiments of Si wafer were performed using this pad with D.I.water of pH=10.5 instead of conventional nanosilica polishing slurry. Several investigations were performed by comparing with fixed-silica pads using conventional irregular natural silica abrasive and spherical fused silica, the polishing performance the fixed- abrasive pad using nano-aggregate silica were obtained and some factors affecting the pad′s polishing performance also were investigated. The material removal rate same as the exiting polishing nanosilica slurry (concentration 3wt%，pH=10.5) was obtained, and polished surface roughness was decreased by about 1/3 . Compared with the pad with fixed-conventional natural silica, the proposed fixed-aggregate silica pad is not easy to scratch Si wafer, because the nano-aggregate silica is not only a spherical shape but also has a elastic coefficient down to its 1.4%-60%. As compared with the pad with spherical fused silica, the proposed fixed-aggregate silica pad improves its adsorb ［-OH］ ion by 25 times in D.I.water of pH=10.5, and allows the removal of material mainly came from chemical removing to be more than 70%. Moreover, nanoscale polished surface roughness is almost no changed with increasing the sizes of fixed-aggregate silica particles, but the polishing ability of pre-polishing surface roughness has been increased, which shows a micron particle size effect.