Photonics Research, Volume. 11, Issue 8, 1465(2023)

High-responsivity InAs quantum well photo-FET integrated on Si substrates for extended-range short-wave infrared photodetector applications Editors' Pick

DaeHwan Ahn1、†, Sunghan Jeon1,2、†, Hoyoung Suh1, Seungwan Woo1, Rafael Jumar Chu1, Daehwan Jung1, Won Jun Choi1, Donghee Park1, Jin-Dong Song1, Woo-Young Choi2, and Jae-Hoon Han1、*
Author Affiliations
  • 1Center for Opto-Electronic Materials and Devices, Korea Institute of Science and Technology (KIST), Seoul 02792, Republic of Korea
  • 2Department of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
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    References(45)

    [11] S. Manda, R. Matsumoto, S. Saito, S. Maruyama, H. Minari, T. Hirano, T. Takachi, N. Fujii, Y. Yamamoto, Y. Zaizen, T. Hirano, H. Iwamoto. High-definition visible-SWIR InGaAs image sensor using Cu-Cu bonding of III-V to silicon wafer. IEEE International Electron Device Meeting, 390-393(2020).

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    DaeHwan Ahn, Sunghan Jeon, Hoyoung Suh, Seungwan Woo, Rafael Jumar Chu, Daehwan Jung, Won Jun Choi, Donghee Park, Jin-Dong Song, Woo-Young Choi, Jae-Hoon Han. High-responsivity InAs quantum well photo-FET integrated on Si substrates for extended-range short-wave infrared photodetector applications[J]. Photonics Research, 2023, 11(8): 1465

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    Paper Information

    Category: Optoelectronics

    Received: Mar. 23, 2023

    Accepted: Jun. 19, 2023

    Published Online: Aug. 2, 2023

    The Author Email: Jae-Hoon Han (hanjh@kist.re.kr)

    DOI:10.1364/PRJ.491498

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